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Semi-encapsulated conductive foam

2024-04-11 16:40:34
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Semi-encapsulated conductive foam
Detailed introduction:

HFC-GB series conductive foam series, it is used for aerospace, telecommunications, high-speed computer input and output interface shielding. (Structure can be freely changed according to customer needs)

产品特点FEATURES- HONGFUCHENG -

  • 01It has excellent surface conductivity

  • 02With strong low stress, high resilience

  • 03It has excellent electromagnetic shielding efficiency

  • 04The product is easy to process and can be die-cut to any length

  • 05The product is non-toxic and tasteless, not easy to decompose, and the waste is easy to dispose of

  • 06Products comply with RoHS directive and pass halogen-free certification

产品参数PRODUCT PARAMETERS- HONGFUCHENG -

SMT 04

产品结构PRODUCT STRUCTURE- HONGFUCHENG -

产品结构

应用领域APPLICATION FIELD- HONGFUCHENG -

  • Handheld mobile electronic devices

    Wireless communication equipment

    Chip module

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