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Thermal gel Series - HTG800

2024-04-20 17:23:50
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Thermal gel Series - HTG800
Detailed introduction:

HFC HTG-800 series, thermal gel is a single component, highly adaptable thermal interface material, the material has a superior stress and strain value than the ultra-soft thermal silicone gasket, can automatically glue coating, is a solution choice for multiple chips sharing a heat sink/structural part.

产品特点FEATURES- HONGFUCHENG -

01High thermal conductivity, low thermal resistance

02No silicone oil precipitation, no pollution

038.0W Thermal conductivity

04Excellent operability

产品参数PRODUCT PARAMETERS- HONGFUCHENG -

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应用领域APPLICATION FIELD- HONGFUCHENG -

半导体块和散热器Semiconductor block and heat sink

电源电阻器与底座之间Between the power resistor and the base

调节器与装配表面Regulator and assembly surface

热电冷却装置Thermoelectric cooling unit

高性能中央处理器及显示卡处理器High performance CPU and graphics card processor

5G基站5G base station


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