HFC HTG-800 series, thermal gel is a single component, highly adaptable thermal interface material, the material has a superior stress and strain value than the ultra-soft thermal silicone gasket, can automatically glue coating, is a solution choice for multiple chips sharing a heat sink/structural part.
01High thermal conductivity, low thermal resistance
02No silicone oil precipitation, no pollution
038.0W Thermal conductivity
04Excellent operability
半导体块和散热器Semiconductor block and heat sink | 电源电阻器与底座之间Between the power resistor and the base | 调节器与装配表面Regulator and assembly surface |
热电冷却装置Thermoelectric cooling unit | 高性能中央处理器及显示卡处理器High performance CPU and graphics card processor | 5G基站5G base station |
telephone:178-3033-7283 | |
landline:023-41660051 | |
mailbox:cq-hr@szemi.cn | |
Address: No. 100 and No. 2, Group 11, Tangfang District, Qingzhi Street, Bishan District, Chongqing, China (Floor 1-4, Plant 4) |
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