What are the common problems of heat-conducting double-sided tape

In the process of external use will inevitably encounter unexpected problems, no matter the size of the problem will have an impact on our normal process, so we have to understand in advance, so that we can not only prevent the occurrence of problems, but also deal with the problem in time when it occurs, then we will talk about the common problems of heat-conducting double-sided tape for you. The following four problems generally occur:
　　1. What is the difference between "heat conduction" and "heat dissipation"?
　　There are three forms of heat transfer: conduction, convection, and radiation. Conduction is between the contact objects or different parts of the same object, due to the temperature difference, heat transfer from high temperature to low temperature heat transfer method. Heat dissipation is a way to dissipate the heat generated by the heat source in the form of convection and radiation to the surrounding environment of the heat dissipation body.
　　2, generally need to achieve the function of heat dissipation is not installed metal heat sink?
　　Heat-conducting double-sided tape

Because the metal heat sink itself is hard, if the installation Angle and contact surface pressure are not average when in contact with the IC, the heat source will not be effectively transmitted to the heat sink, if the two surfaces are equipped with thermal double-sided adhesive soft material can effectively overcome the problem of insufficient contact surface.
　　3. How long is the life of heat-conducting double-sided tape?
　　Our heat-conducting double-sided adhesive product itself with substrate silicone rubber is generally identified as having a service life of 20 years, and the life of heat-conducting double-sided adhesive is mainly determined by the service life of silicone rubber.
　　4, how to apply heat transfer double-sided tape, where to use?
　　Generally speaking, if the electronic products you design can not be equipped with fans and metal heat dissipation in space and position, you can directly contact the IC and shell by heat-conducting double-sided tape, and directly transfer the heat source to the cold air outside the product by heat conduction, to achieve the effect of heat dissipation.