Like traditional thermal interface materials, thermal absorbent materials can be directly applied between heat sources and radiators. While exporting heat, it can absorb the leaked electromagnetic radiation and achieve the purpose of eliminating electromagnetic interference. Provide good solutions for electronic communication products in thermal conductivity and electromagnetic shielding.
[Length and width] 300mm×400mm can be customized according to requirements.
[Application Band] The recommended application band is 15-30 GHz.
[Product thickness] 0.5mm-3mm can meet different customer needs.
01Dual advantages of absorbing wave and conducting heat
02Good surface compatibility comes with viscosity
033.0W thermal conductivity, small thermal impedance
04The highest fire rating UL94 V0
Server chip | Server chip | Netcom device heat dissipation |
Between the chip and the heat dissipation module | Board chip | Netcom device heat dissipation |
Laptop cooling module | Automotive electronics | 5G base station |
telephone:178-3033-7283 | |
landline:023-41660051 | |
mailbox:cq-hr@szemi.cn | |
Address: No. 100 and No. 2, Group 11, Tangfang District, Qingzhi Street, Bishan District, Chongqing, China (Floor 1-4, Plant 4) |
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