HFC BNS-80 series, based on self-developed high-quality 2D boron nitride nanosheets, has successfully prepared 2D boron nitride cooling film with controllable area and thickness, with high thermal conductivity, high insulation, high flexibility, low dielectric coefficient, low dielectric loss and other excellent characteristics. In order to solve the "stuck neck" problem faced by the field of electronic packaging and thermal management in the current 5G era, it provides advanced thermal management material solutions and related material production technology, and is an innovative high-tech product in the field of two-dimensional material technology.
Application features:
● High thermal conductivity
● High insulation
● High flexibility
● Low dielectric
Recommended application fields:
● 5G RF chip
● Millimeter wave antenna
● Wireless charging and transmission
● Printed circuit board
● AI, Internet of Things, etc