Analyze the principle of thermal conductive silica gel sheet

In the continuous development of electronic equipment, the thermal conductivity material of electrical components is also the development of electrical appliances, which has become a hot industry on the market, such as the thermal silicone sheet in the thermal conductivity material. It is necessary to know that the thermal conductive silicone sheet has certain flexibility, excellent insulation, compressibility, and natural viscosity on the surface. The electronics company designed and produced thermal silicone sheets for product gap heat transfer, which can fill the gap, complete the heat transfer between the heating part and the heat dissipation part, and also play the role of insulation and shock absorption. The compact design can meet the product requirements of miniaturization and ultra-thin equipment, so it is also widely used in electronic and electrical products.
　　So what is the principle of thermal conductive silicone sheet?

It is necessary to know that the thermal conductive silicone sheet is also made of ordinary silicone as raw materials, and then it is necessary to make the thermal conductive silicone sheet become a very good thermal conductive silicone product through a special process, its role is the main user in the high temperature products play the role of heat transfer, thermal conductive silicone sheet finished products have good insulation, mechanical, sealing, not deformation.
　　Although the principle of thermal silicone sheet is said, but the thermal silicone sheet can be applied to household appliances, such as air conditioners, microwave ovens, heaters and other appliances are required to heat the silicone sheet; In the power supply industry, such as transformers, capacitors, resistors, inductors and other products, as long as they belong to high-power components. And in the led industry thermal conductive silicone sheet is also widely used, it can be used to connect led lamp products in the aluminum substrate and heat sink link to heat dissipation.