Mobile: 17830337283
Seat machine: 023-41660051
Mail box: cq-hr@szemi.cn
The website is www.cqhfc.com
Address: No. 100 and No. 2, Group 11, Tangfang District, Qingzhi Street, Bishan District, Chongqing, China (Floor 1-4, Plant 4)
HFC H1000 thermal silicone gasket is a thermal interface material with low compressive stress. The product has good electrical insulation characteristics and stability, high fire resistance, the product surface has natural viscosity, can fill the gap well, and realize the heat transfer between the heating part and the cooling part. It is an excellent thermal conductive filling material, which is widely used in electronic components products.
01Super soft, good compressibility
02No or low rebound stress
03Good interface contact, low pressure application
04Good insulation, high voltage breakdown resistance
项目 Items | 技术指标 Value | 检测仪器 Test Instrument | 检测标准 Test Method |
颜色 Color | 灰白色 可根据客户要求调色 | 目视 Visual | -- |
厚度(mm) Thickness | 1~4 | PEACOCK厚度规 PEACOCK THICKNESS METER | ASTM D374 |
规格 Specification | 根据客户要求 Can be Custom-made | -- | ASTM D1204 |
密度(g/cc) Density | 3.2(±0.2) | BS-H电子天平 BS-H ELECTRONIC BALANCE | ASTM D792 |
硬度(Shore C) Hardness | 18(±5) | LX-C型微孔材料硬度计 LX-C CELLULAR MATERIAL DUROMETER | ASTM D2240 |
导热系数(W/m.K) Thermal Conductivity | 7.0(±0.2) | Long-Win9389导热系数测试仪 Long-Win9389 THERMAL CONDUCTIVITY TESTER | ASTM D5470 |
热阻(℃in2/W)(@20psi&1mm) Thermal Resistance | ≤0.28 | DRL-Ⅲ导热系数测试仪 DRL-Ⅲ THERMAL CONDUCTIVITY TESTER | ASTM D5470 |
击穿电压(KV)(@1mm) Breakdown Voltage | ≥8 | MS2676A耐压测试仪 MS2676A WITHSTAND VOLTAGE TESTER | ASTM D149 |
体积电阻率(Ω.cm) Volume Resistivity | ≥108 | ZC-36高绝缘电阻测量仪 ZC-36 HIGH DIELECTRIC RESISTANCE TESTER | ASTM D257 |
压缩比(%)(@50psi) Compression Ratio | ≥50 | 压缩力测试仪 COMPRESSINVE FORCE TESTER | ASTM D575-1991 |
拉伸强度 (Mpa) Tensile Strength | ≥0.05 | 拉力试验机 TENSION TESTER | ASTM D412-1998A |
延伸率(%) Elongation | ≥40 | ||
防火性能 UL Certify | UL94-V0 | 阻燃测试仪 FLAME RATING TESTER | UL 94 |
使用温度 (℃) Operating Temperature | -50~180 | 可程式冷热冲击箱 PROGRAMMABLE THERMAL SHOCK TESTER | -- |
芯片与散热模块之间Between the chip and the heat dissipation module | 光电行业Photoelectric industry | 网通产品Netcom products |
汽车电子Automotive electronics | 可穿戴设备Wearable device | 5G基站 5G base station |
 | telephone：178-3033-7283 |
 | landline：023-41660051 |
 | mailbox：cq-hr@szemi.cn |
 | Address: No. 100 and No. 2, Group 11, Tangfang District, Qingzhi Street, Bishan District, Chongqing, China (Floor 1-4, Plant 4) |
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