HFC HFS-15 is a thermal conductive gasket with good thermal conductivity and low thermal resistance. It can effectively fill the air gap between the heating end and the cooling end, realize the heat transfer between the heating part and the cooling part, and greatly reduce the interface thermal resistance. At the same time, the energy heat sink can also be used under lower stress conditions to avoid the installation stress on the chip, PCB and other parts of the damage. The product has excellent processability and usability, and can be used for photoelectric modules, Netcom and other equipment requiring heat transfer.
[Length and width] 120mm×120mm.
01High thermal conductivity and low thermal resistance
02Low stress assembly
03Good thermal stability
04Multiple thickness options, wide application range
项目 | 技术指标 | 检测仪器 | 检测标准 |
颜色 | 黑色 | 目视 | -- |
厚度(mm) | 0.5-3.0 | PEACOCK 厚度规 | ASTM D 374 |
规格 | 120mm×120mm | 数显卡尺 | ASTM D 5947 |
密度(g/cc) | 3.0(±0.2) | ZMD-2电子密度仪 | ASTM D 792 |
硬度(Shore 00) | 65(±10) | LX-C型微孔材料硬度计 | ASTM D 2240 |
拉伸强度 (Mpa) | ≥0.1 | 拉力试验机 | ASTM D 412 |
延伸率(%) Elongation | ≥100 | 拉力试验机 | ASTM D 412 |
撕裂强度(N/mm) | ≥0.5 | 拉力试验机 | ASTM D 624 |
压缩比(%)(@50psi) | ≥50(@50psi) | 压缩力测试仪 | ASTM D 695 |
导热系数(W/m·K) | 24.0(±5) | LW-9389导热系数测试仪 | ASTM D 5470 |
热阻(℃in2/W)(@20psi&1mm) | ≤0.15(@20psi/2mm) | LW-9389导热系数测试仪 | ASTM D 5470 |
使用温度 (℃) | -50~130 | XB-OTS-150D-C可程式冷热冲击箱 | IEC 60068-2-14 |
卫星satellite | 雷达radar | 大型服务器Large server |
光电行业Photoelectric industry | 网通产品Netcom products | 可穿戴设备Wearable device |
telephone:178-3033-7283 | |
landline:023-41660051 | |
mailbox:cq-hr@szemi.cn | |
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