Ultrathin superconducting plate VC technology can not only effectively solve the problem of heat conduction and diffusion of high-density integration, heat concentration and space limited products, extend the service life of the product, but also reduce the product design space, making the product thinner and more miniaturized.
[Product thickness] 0.3mm~0.45mm can meet different customer needs.
01Flexible form factor design
02ultra-thin
03Strong heat conduction ability
04No power transfer, energy saving
05High security and reliability
项目item | 参数argument | 单位unit | 测试方法Test method |
颜色colour | 铜本色Copper color | -- | 目视visual |
厚度thickness | 0.35~0.5 | mm | ASTM D 374 |
使用温度Service temperature | -40~100 | ℃ | IEC 60068-2-14 |
温差Temperature difference | ≤5 | ℃ | HFC测试标准Test standard |
Tcase | ≤90 | ℃ | HFC测试标准Test standard |
导热系数Thermal conductivity | ≥5000 | W/m·K | HFC测试标准Test standard |
The above data is provided by HFC Laboratories, which reserves the right of final interpretation |
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