Hfc-thermal graphite foam is made of thermal graphite sheet and PU foam core wrapped, and on one or two sides of the adhesive to facilitate better bonding use, in the heat conduction effect at the same time, but also play a buffer role, specifications can be customized according to requirements, can also die cut into the required shape. Widely used in electronic chassis, chassis, indoor chassis, industrial equipment, notebook computers, mobile communication equipment and other heating components of heat conduction and shockproof buffer. Relevant customers have been involved in consumer electronics, communications, automotive, medical, military, aerospace and many other application fields.
01With low thermal resistance, high thermal conductivity
02With viscosity, easy to use, good resilience
03The product is easy to process and can be die-cut to any length
04The product is non-toxic and tasteless, not easy to decompose, and the waste is easy to dispose of
05Products comply with RoHS directive and pass halogen-free certification
Handheld mobile electronic devices | Wireless communication equipment | Chip module |
telephone:178-3033-7283 | |
landline:023-41660051 | |
mailbox:cq-hr@szemi.cn | |
Address: No. 100 and No. 2, Group 11, Tangfang District, Qingzhi Street, Bishan District, Chongqing, China (Floor 1-4, Plant 4) |
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