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SMT conductive foam

2024-04-11 16:38:51
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SMT conductive foam
Detailed introduction:

HFC-SMT foam is a conductive contact terminal with excellent elasticity that can be reflow soldered to PCB boards by SMT for EMI, ground or conductive terminals. The filling body is composed of silica gel, and the film with metal coating as the inner and outer layer is processed by high temperature. It has smooth surface, superior resilience, high temperature resistance, excellent electrical conductivity and oxidation resistance, good welding strength, and products meet the EU ROSH requirements. The solder used in reflow welding has good contact with tin, and the solder has good contact strength with the PCB board.

产品特点FEATURES- HONGFUCHENG -

  • 01Good electrical conductivity at low compression rate (10%-20%)

  • 02Surface contact mode, stable compression force, avoid antenna contact damage

  • 03Can be used for secondary welding

  • 04Small occupation area, increase the antenna headroom area

  • 05High resilience

  • 06Automatic mounting

产品参数PRODUCT PARAMETERS- HONGFUCHENG -

SMT 04

产品结构PRODUCT STRUCTURE- HONGFUCHENG -

产品结构

产品规格PRODUCT SPECIFICATIONS- HONGFUCHENG -

产品规格

(1) Other sizes can be according to customer demand, length can be arbitrary, process width: W≥2mm, height: 2mm≤H≤15mm.
⑵ Product tolerance: W/H/L<50mm, ±0.48mm; 50mm≤W/L<100mm, ±0.68mm W/L≥100mm, ±0.98mm.
Note: The shape and structure of the product can also be designed according to customer requirements

产品应用APPLICATIONS- HONGFUCHENG -

Operating temperature:
★ Store at room temperature, avoid direct sunlight, at 23℃±5℃, 65%±5%RH, valid for 3 months.
★ The above data are our actual test results, the final interpretation right in our laboratory.
★ If you have any questions about our products, please contact our staff to better serve you.

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应用领域APPLICATION FIELD- HONGFUCHENG -

  • □ RF grounding, electromagnetic interference
    □ DC grounding eliminates static electricity
    □ RF interconnection, RF interference shielding gasket
    □ The shell is grounded to the printed circuit board
    □ Components are grounded to the printed circuit board

产品包装PRODUCT PACKAGING- HONGFUCHENG -

产品包装

This product adopts advanced automatic sealing mode, and the product is packaged in a roll bag, which can avoid damage during transportation and storage. This product packaging design is convenient for transportation, storage, but also to ensure the quantity of products. The packaging quantity of each roll is calculated in integers, which can be divided into 1000pcs, 1500pcs, 2000pcs, each roll (or subject to customer requirements), or in bulk. The advantage of this product packaging is that guests can use fully automatic and semi-automatic production lines during assembly.

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